Inside ASEAN
Broadcom and Toppan Launch Singapore's First Advanced Chip Substrate Facility
The joint venture aims to enhance Singapore's position in the global semiconductor supply chain amid rising AI demand.
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CompanyJapan
Toppan
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Business overview
Company backgroundToppan is a Japanese company founded in 1900 that leverages core printing technologies to create value across diverse fields including digital and sustainability transformation.
Toppan has established its first overseas production site for FC-BGA semiconductor package substrates in Singapore through Advanced Substrate Technologies Pte., Ltd., to meet global demand for advanced substrates. Toppan develops and produces semiconductor package substrates including FC-BGA and next-generation package substrates using advanced photolithography and build-up wiring technologies.
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