Inside ASEAN
Broadcom and Toppan Launch Singapore's First Advanced Chip Substrate Facility
The joint venture aims to enhance Singapore's position in the global semiconductor supply chain amid rising AI demand.
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CompanyJapan
Toppan Holdings Inc.
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Business overview
Company backgroundToppan Holdings Inc. is a Japanese company founded in 1900 that leverages core printing technologies to create value across diverse fields, focusing on digital and sustainability transformation.
Toppan Holdings established its first overseas FC-BGA substrate production site in Singapore through a joint venture named Advanced Substrate Technologies Pte Ltd (AST). Advanced Substrate Technologies Pte Ltd (AST) is a joint venture between Broadcom Inc. and Toppan Holdings Inc., specializing in the design and manufacturing of advanced Flip Chip Ball Grid Array substrates in Singapore.
AST's Singapore facility represents Toppan Holdings' first FC-BGA manufacturing venture outside Japan, integrating advanced automation and R&D to meet global semiconductor substrate demand.
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